Ceramic Substrates

Nowadays, the electronic and information technology get more and more integration, micromation and multi-function, so the production of electronic technology must be developed smaller, lighter, thinner, having higher stability, higher speed and more functions
Especially, to meet the need of surface mounting technology (SMT) and the trend of using multilayer, microchip, integration, module and multi-function in functional Ceramic Devices, our Company now produces High Performance Alumina and High Thermal Conductivity AlN ceramic substrates at all specifications.
The technical source of manufacturing high performance 96 alumina and high thermal conductivity AlN ceramic substrates is the research result of the state key laboratory of advanced ceramics and fine processing, Tsinghua University, which is an important research achievement of national fund of natural science.
High performance alumina ceramics substrates mainly are used in all specifications of high precision applications of HIC, chip resistance, network resistance, assemble potentiometer, semiconductor refrigerator and power module.High thermal conductivity AlN ceramic substrates are used in the applications of high density HIC and encapsulation, power module and high effective radiator.