| Criterio
de aceptación de los substratos marcados por láser
(unidades: mm) |
Ranking Qualified |
Qualified |
Fine(laser
process) |
Excellent(edge
whet) |
Effective
dimension |
Length<=152.4,
Width<=101.6 |
Length
tolerance |
Thickness<=0.63 |
+0.20-0.05 |
+0.15-0.05 |
+0.10-0.05 |
0.63<Thickness<=0.76 |
+0.25-0.05 |
+0.20-0.05 |
0.76<Thickness<=1.0 |
+0.30-0.10 |
+0.25-0.10 |
Thickness |
Any
thickness between 0.254 and 1.016; common thicknesses used are:
0.38, 0.63, 0.76, 1.00 |
Thickness
tolerance |
±10%,
and NLT ±0.05 |
±7%,and
NLT ± 0.05 |
±7%,
and NLT ±0.05 |
Scribing
to Scribing tolerance |
±0.05 |
Minimum
scribing width |
0.10 |
Hole
dimension |
Minimum
diameter of round hole is 0.30; Minimun side length of square
hole is 0.30 |
Edge-to-scribed
line (the middle of hole) |
Thickness<=0.63 |
+0.20
-0.05 |
+0.15
-0.05 |
±0.05 |
tolerance |
0.63<Thickness<=0.76 |
+0.25-0.05 |
+0.20-0.05 |
±0.05 |
0.76<Thickness<=1.0 |
+0.30-0.10 |
+0.25-0.05 |
±0.08 |
Hole
tolerances |
0.30-2.0 |
±0.08 |
±0.05 |
±0.05 |
2.0-10.0 |
±0.15 |
±0.10 |
±0.10 |
>10.0 |
±1.0% |
±0.8% |
±0.8% |
Center-to-Center
distance of Holes tolerance |
±0.05 |
±0.05 |
±0.05 |
Minimum
distances of Hole-to-Hole and Hole-to-Edge |
>=12
times thickness of the substrate, and NLT 1.0mm |
Difference
between entry diameter and exit diameter of a hole |
<=8%
thickness of the substrate |
Camber |
<=0.076/25.4(long
side), NLT 0.05mm |
<=0.05/25.4(long
side),NLT0.05mm |
<=0.05/25.4(long
side),NLT0.05mm |
Parallel
degree/vertical degree |
0.4%
of the longest side |
0.3%
of the longest side |
0.30%
of the longest side |